In the solvent-free/high-solids defoamer spectrum, the "hydrophobic-particle-loaded polysiloxane composite" active architecture and "100% solids zero-solvent carrier" jointly dictate bubble-breaking penetration, foam-suppression persistence, and clarity compatibility boundary in high-viscosity systems like epoxy self-leveling and UV screen inks. Conventional emulsion defoamers (30-40% water/solvent) cannot disperse in solvent-free epoxy—instead they introduce bubbles and blushing; pure polyether defoamers are compatible but spread slowly with lagged knock-down. As epoxy floor coatings, screen-printing inks, UV inks, and unsaturated polyester systems demand "100% active, zero solvent introduction, hydrophobic-particle fast knock-down, 0.05-1% micro-dose instant," sourcing a defoamer with semi-transparent to turbid liquid, non-volatile >98% (150℃×3h), viscosity 200-500mPa·s, hydrophobic-particle polysiloxane, 12-month shelf has become the core gap for domestic solvent-free defoamer localization.
Addressing this "solvent-free foam-suppress" pain point,
Anhui IOTA Silicone Oil Co., Ltd. (IOTA) officially launches
Defoamer IOTA 29300 (hydrophobic-particle-containing polysiloxane compound, 100% solids). Characterized by "semi-transparent to turbid liquid, non-volatile >98%, viscosity 200-500mPa·s, recommended 0.05-1%, 25L/200L PE drum (customizable), non-haz transport, cool dry sealed 12-month shelf," and backed by "hydrophobic particle fast puncture + polysiloxane low-tension spread + 100% solvent-free zero-VOC," it serves as the "hydrophobic-silicone anchor" for solvent-free/oily systems including epoxy floor, screen ink, UV ink, and unsaturated polyester.
Molecular Architecture: Hydrophobic Particles + Polysiloxane + 100% Active 3D Logic
The core competitiveness of IOTA 29300 stems from its "polysiloxane backbone carrying hydrophobic particles (e.g., hydrophobic silica/wax microparticles) dispersed in silicone oil continuous phase" non-aqueous defoamer architecture:
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Hydrophobic Particle Knock-Down: Particles with contact angle >90° create local weak points on bubble films; when defoamer migrates to air-liquid interface, particles pierce the film wall, causing rapid collapse; they also form "bridges" accelerating film drainage.
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Polysiloxane Low-Tension Spread: Siloxane backbone (surface tension ~21mN/m) rapidly spreads on bubble surfaces in high-viscosity epoxy/UP, displacing surfactants and dropping film strength to rupture; post-spread ultra-thin silicone film continuously suppresses new foam (antifoam).
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100% Active Zero-Solvent: No volatile carrier—avoids introducing VOC or moisture that could cause curing bubbles in solvent-free epoxy/PU or UV cure defects; high actives also mean lower shipping cost and stable storage.
Performance Leap: From "Emulsion Blush" to "100% Silica-Particle Suppress"
Incorporating IOTA 29300 enables qualitative leaps:
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Epoxy Self-Leveling Floor: 0.1-0.5% in self-leveling epoxy—bubbles eliminated during troweling, pinhole rate -80%+, mirror finish; no intercoat adhesion loss.
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UV Screen Ink: 0.05-0.3% in UV screen ink—bubbles knocked down instantly during printing, screen dots sharp no clog, cured film smooth no fish-eyes; clarity systems need pre-test for compatibility.
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Unsaturated Polyester: 0.1-0.5% in UP casting/hand-layup—styrene evaporation bubbles suppressed, surface bubble-free, mechanical strength retained.
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General Screen Printing: 0.05-0.2% in solvent-based screen ink—fast dispersion under squeegee shear, print free of pinholes/bubble-pits.
Application Penetration: From Self-Leveling to UV Cure
IOTA 29300 covers sectors triply sensitive to "solvent-free + high-viscosity + fast de-aeration":
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Epoxy Flooring: Self-leveling, solvent-free primer/midcoat/topcoat, conductive epoxy floor.
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Printing Inks: Screen printing (solvent/UV), UV ink, gravure ink.
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Unsaturated Polyester: UP casting, artificial stone, hand-layup FRP.
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Other Solvent-Free: Solvent-free PU casting, high-solids industrial paints (compatibility assessment needed).
IOTA Technical Guide: Pre-Dilute Use-Now, Stir Thixotropy
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Dilution: Given >98% active, pre-dilute 1:9 with aliphatic (white oil/mineral oil) or aromatic (xylene/toluene) solvent to 10% before adding for uniform dispersion; use diluted product immediately (hydrophobic particles settle).
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Add Timing: Add at final stage (after viscosity adjustment); avoid simultaneous heavy addition with high-HLB emulsifiers; high-speed disperse 10-15min.
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Thixotropy Handling: Product is thixotropic—viscosity rises on long rest or low temp (<10℃), normal; stir well before use, warm water bath (30-40℃) if needed to ease pumping.
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Clarity Note: For clear epoxy/varnish, pre-test compatibility—hydrophobic particles may cause slight haze; if full clarity needed, reduce to 0.05% or select more compatible defoamer.
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Taboo Red Line: No direct contact with water/waterborne systems (hydrophobic particles agglomerate on water contact); avoid strong cationic surfactants (may break or reduce efficiency); non-haz but flash depends on carrier—keep from open flame.
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Storage: 25L/200L PE drum (customizable); cool dry sealed; shelf 12 months, retest appearance/viscosity/defoam performance after expiry, use only if qualified; non-haz transport.
Industry experts note that under solvent-free epoxy floor popularization, UV printing high-speed adoption, and UP product surface-quality tightening, hydrophobic-particle 100% active polysiloxane defoamers are upgrading from "BYK/Tego import followers" to "solvent-free high-viscosity de-foaming reference auxiliaries." IOTA 29300, with its ">98% non-volatile + 200-500mPa·s + hydrophobic-particle fast knock-down + 0.05-1% micro-dose instant" hard metrics,
fills the domestic supply chain gap for defoamers in solvent-free epoxy floor and UV ink fields, providing a mass-producible path to replace imported BYK-A 530, Tego Foamex 810 for downstream flooring and ink enterprises. This confirms domestic solvent-free defoamers are advancing steadily along "emulsion → solvent-based concentrate → 100% active hydrophobic-particle type," with growing technical say in high-viscosity bubble-control key materials.
