Silica sol is the most widely used soft abrasive in the CMP process. It can effectively remove the damaged layer on the workpiece surface and reduce the surface roughness during the polishing process. Its good chemical stability and controllable particle size distribution can achieve efficient flattening while ensuring the surface quality of the workpiece.
Provide abrasive: Silica sol is the main raw material for preparing nano-silicon dioxide polishing liquid. It provides the abrasive required in the CMP process to achieve the grinding and removal of workpiece surface damage.
Regulate polishing rate: Adjust the concentration and particle size of silica sol according to different polishing requirements to achieve the required polishing rate.
Improve surface quality: The chemical components in silica sol react chemically with the workpiece surface to soften it, and cooperate with mechanical grinding to improve the surface quality after polishing.