In microelectronic and optoelectronic packaging scenarios such as electronic component moisture-proofing, transistor and integrated circuit inner coating, and optical instrument elastic bonding, the four-dimensional performance of "transmittance — internal stress — temperature range — deep curing" of potting materials has always been the core contradiction restricting device service life and optical performance. Traditional epoxy potting adhesives, while high in hardness and strong in bonding, suffer from high internal stress after curing, prone to cracking, and their transmittance drops sharply with aging; conventional condensation-molded silicone potting gels, despite good elasticity, release small-molecule by-products during curing, making deep complete curing difficult, with poor long-term yellowing resistance; while simply modified silicone gels often lose elasticity below -40℃, failing to handle wide-temperature conditions. With the continuous upgrading of demands for "high transmittance (≥93%), low-stress elasticity, high-low temperature resistance (-59~200℃), solvent-free deep curing" in LED packaging, optical sensors, precision integrated circuits, etc., sourcing a "two-component addition-molded phenyl silicone gel, 1:1 mixing, room-temperature curing, ShoreA00 25±5, volume resistivity >1.0×10¹⁴ Ω·cm" high-performance electronic packaging material has become the core gap for domestic high-end electronic adhesive autonomy.
Addressing this,
Anhui IOTA Silicone Oil Co., Ltd. officially launches
IOTA GNJ 3128H Phenyl Silicone Gel. Characterized by "two-component addition-molded silicone gel; A/B component viscosity both 600±200 cp; after mixing A:B=1:1, transparent, mixed viscosity 600±200 cp; operating time ≤240 min, curing time 24h (22℃); ShoreA00 25±5; density 0.98 g/ml; transmittance ≥93%; volume resistivity >1.0×10¹⁴ Ω·cm; viscosity and curing time adjustable per user request; A component 15kg/drum or 5kg/drum, B component 15kg/drum or 5kg/drum; store 6 months in cool, ventilated, dry place; transported as non-dangerous goods", backed by "phenyl-modified polysiloxane + addition curing + low-stress elasticity + high transmittance yellowing resistance + solvent-free deep curing", it serves as the "transparent shield" for electronic component moisture-proofing and optical instrument elastic bonding,
achieving the leap from "condensation by-product release" to "addition by-product-free deep curing".
System Positioning: Addition Silicone Gel vs. Condensation Potting Adhesive
IOTA GNJ 3128H belongs to the addition-molded silicone gel system, distinct from traditional condensation-molded potting adhesives. Condensation adhesives rely on hydroxyl and alkoxy condensation, continuously releasing alcohol or ketone by-products during curing, making deep complete curing difficult and easily causing bubbles in enclosed cavities leading to device failure; while addition-molded silicone gels, through platinum-catalyzed hydrosilylation, generate no by-products during curing, with extremely low volatiles, enabling thick-layer complete curing. Meanwhile, the introduction of phenyl groups significantly improves high-low temperature performance and transmittance, thoroughly avoiding the application shortcomings of condensation products.
Molecular Architecture: Phenyl Modification for Temp/Transmittance + Addition By-Product-Free Curing + Low-Stress Elasticity
The core competitiveness of IOTA GNJ 3128H stems from the precision molecular architecture of phenyl-modified polysiloxane and addition curing:
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Phenyl Modification Enhances Temperature and Transmittance: Phenyl groups introduced into the molecular backbone break the regular crystallization of polydimethylsiloxane, granting excellent high-low temperature performance (long-term service at -59~200℃), while the high refractive index and structural uniformity of phenyl groups enable cured transmittance ≥93%, with long-term yellowing resistance.
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Addition Curing Achieves Low-Stress Elasticity: Platinum-catalyzed hydrosilylation forms a 3D network, with crosslinking density precisely controlled in the ultra-low hardness range of ShoreA00 25±5, maintaining elasticity over a wide temperature range after curing, with extremely low internal stress and easier rework, providing flexible protection for precision electronic components.
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High-Purity Formula Ensures Insulation: Solvent-free, low-volatile formula, volume resistivity >1.0×10¹⁴ Ω·cm, ensuring excellent electrical insulation, preventing leakage and signal interference.
Performance Leap: From "Condensation By-Products" to "Addition High-Transmittance Low-Stress"
Introducing IOTA GNJ 3128H brings a qualitative leap to electronic packaging and optical bonding:
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High Transmittance and Long-Term Yellowing Resistance: Transmittance ≥93%, no yellowing or loss of transparency under long-term 200℃ or -59℃ conditions, suitable for optical instrument elastic bonding and LED packaging.
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Low-Stress Elasticity and Easy Rework: Ultra-low hardness ShoreA00 25±5, maintains elasticity after curing, extremely low internal stress, no stress damage to precision chips, and easy peeling for rework in case of failure.
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Wide Temperature Range: Long-term service at -59~200℃, no cracking or debonding under thermal shock, suitable for extreme environments like military and aerospace.
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By-Product-Free Deep Curing: Addition curing releases no small molecules, enabling deep and complete curing, suitable for thick-layer potting and enclosed cavities.
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Excellent Waterproof, Moisture-Proof and Anti-Aging: Forms a dense elastomer after curing, extremely low water absorption, preventing moisture penetration causing circuit corrosion and extending device life.
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High Insulation: Volume resistivity >1.0×10¹⁴ Ω·cm, ensuring electrical safety in high-voltage environments.
Application Penetration: From Transistor Inner Coating to Optical Instrument Bonding
The application boundary of IOTA GNJ 3128H covers all electronic and optical scenarios requiring "high transmittance + low stress + wide temperature + deep curing":
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Electronic Component Moisture-Proofing (Main Battlefield): Inner coating and moisture-proof encapsulation for transistors, integrated circuits, sensors, etc., preventing moisture erosion causing short-circuit failure.
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Optical Instrument Elastic Bonding: Lens modules, optical sensors, LED lenses and other bonding scenarios requiring high transmittance and elastic buffering.
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Precision Device Potting: Potting protection for relays, power modules, automotive electronics and other applications with high requirements for low stress and high reliability.
IOTA Technical Guide: 1:1 Mixing, Avoid Toxins and Contamination
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Application: Clean materials before use, ensure dry and pollution-free; mix A and B components at weight ratio 1:1, vacuum defoaming recommended before coating; heating curing can improve production rate and adhesion to substrates.
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⚠️ Taboo: Use mixed glue within one time to avoid waste; strictly avoid contact with N, P, S organic compounds and ionic compounds of Sn, Pb, Hg, As, etc., otherwise causing curing failure; seal and store in cool place before use.
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Storage: Store 6 months in cool, ventilated, dry place; non-dangerous goods, transported as general chemicals.
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Handling: Transparent, viscosity 600±200 cp, operating time ≤240 min, room temperature curing 24h; viscosity and curing time can be adjusted according to user requirements.
Industry Insight: In the field of electronic packaging materials, the molecular architecture of addition-molded phenyl silicone gel — "phenyl for temperature/transmittance + addition for by-product-free curing + low-stress elasticity" — is the key path to achieving the four-in-one of "high transmittance, low stress, wide temperature, deep curing" —
addition curing solves the industry pain point of condensation type "by-product release, difficult deep curing", while the introduction of phenyl ends the application shortcomings of ordinary silicone gels: "narrow temperature range, easy yellowing". IOTA GNJ 3128H, with "two-component addition-molded silicone gel + transmittance ≥93% + ShoreA00 25±5 + volume resistivity >1.0×10¹⁴ Ω·cm + -59~200℃" hard metrics,
fills the key supply chain link for domestic high-end electronic packaging silicone gels in transistor inner coating and optical instrument bonding, providing a mass-producible high-performance solution for downstream electronic manufacturers. This confirms domestic electronic adhesives are leaping toward "condensation potting → addition silicone gel → phenyl-modified addition silicone gel", with growing technical say in high-end electronic packaging.
