In potting protection fields for high-power electronic components such as automotive electronics, power modules, and solar inverters, the four-dimensional performance of "thermal conductivity efficiency — flame retardancy grade — flow and bubble elimination — deep curing" of potting materials has always been the core contradiction restricting device heat dissipation reliability and service life. Traditional condensation-molded potting adhesives release small-molecule alcohol by-products during curing, making deep complete curing difficult, and easily generating bubbles leading to high-voltage breakdown; ordinary epoxy potting adhesives, while high in strength, are brittle and prone to cracking, with poor resistance to thermal cycling shocks, rapidly softening above Tg temperature; while simply formulated silicone potting adhesives often have low thermal conductivity, failing to meet the heat dissipation needs of high-power devices. With the continuous upgrading of demands for "thermal conductivity ≥0.7W/m·K, UL94-V0 flame retardancy, 1:1 mixing for easy application, addition-type no by-products" in new energy automotive electronic control systems, on-board chargers, photovoltaic junction boxes, etc., sourcing a "two-component addition-molded, low-viscosity good leveling, strong adhesion, room-temperature curing" high-performance thermally conductive potting adhesive has become the core gap for domestic automotive-grade electronic adhesive autonomy. Addressing this, Anhui IOTA Silicone Oil Co., Ltd. officially launches IOTA M8760 A/B Room-Temperature Vulcanized Two-Component Silicone Thermally Conductive Potting Adhesive. Characterized by "addition-molded two-component RTV thermally conductive silicone rubber; A/B components 1:1 weight ratio mixing; A component gray, density 1.6g/cm³, viscosity 5000mPa·s; B component white, density 1.6g/cm³, viscosity 4000mPa·s; mixed viscosity 4500mPa·s; room temperature operating time 2h; 23℃/8h curing (1cm thickness); after curing: Shore A 60, tensile strength 2.0MPa, elongation 150%, thermal conductivity 0.7W/m·K, dielectric strength 23KV/mm, volume resistivity 10¹⁵ Ω·cm; flame retardant UL94-V0; A/B 25kg/drum; storage 12 months below 23℃ unopened", backed by "addition no by-product crosslinking + high-fill thermally conductive system + low-viscosity flow + UL94-V0 flame retardancy", it serves as the "thermal sealing shield" for automotive power electronics potting, achieving the leap from "condensation by-product bubble defects" to "addition by-product-free deep thermally conductive potting". System Positioning: Addition Thermally Conductive Potting vs. Condensation Potting Adhesive IOTA M8760 belongs to the addition-molded thermally conductive potting system, distinct from traditional condensation-molded potting adhesives. Condensation potting adhesives rely on hydroxyl and alkoxy condensation reactions, continuously releasing small-molecule alcohol by-products during curing. In thick-layer potting, bubbles are difficult to eliminate, and internal pores after curing cause high-voltage breakdown risks. Addition potting adhesives, through platinum-catalyzed hydrosilylation, generate no by-products during curing, with extremely low volatiles, enabling thick-layer complete curing. Meanwhile, the synergistic design of high-fill thermally conductive fillers and addition base gum enables the material to achieve 0.7W/m·K thermal conductivity while maintaining low-viscosity flow, thoroughly avoiding the application shortcomings of condensation products. Molecular Architecture: Platinum Catalysis By-Product-Free + High-Fill Thermal Network + Low-Viscosity Leveling The core competitiveness of IOTA M8760 stems from the precision formulation architecture of addition crosslinking and thermally conductive filler synergy:

• Platinum-Catalyzed Addition By-Product-Free: Component A contains a built-in platinum catalyst. When mixed with component B's Si-H crosslinker at 1:1, it triggers hydrosilylation with no small molecules released during curing, ensuring no internal bubbles or pores in thick-layer (above 1cm) potting, dielectric strength up to 23KV/mm, volume resistivity 10¹⁵ Ω·cm, providing reliable insulation for high-voltage environments.
• High-Fill Thermal Network Construction: Selected thermally conductive fillers build a continuous thermal conduction path in the silicone rubber matrix, achieving a stable thermal conductivity of 0.7W/m·K, effectively transferring heat from power devices to the casing, reducing junction temperature and extending device life; fillers undergo surface treatment and full dispersion, ensuring A/B component viscosity is controlled in the low-viscosity range of 4000-5000mPa·s, with excellent flow and leveling.
• Flame Retardant Synergistic System Achieves UL94-V0: A halogen-free flame retardant system synergizes with the silicone base material, forming a dense ceramicized carbon layer when exposed to fire, blocking oxygen and heat transfer, easily passing UL94-V0 flame retardancy certification, providing passive fire protection for automotive and power applications.

Performance Leap: From "Condensation Bubble Defects" to "Addition Thermally Conductive Flame-Retardant Leveling" Introducing IOTA M8760 brings a qualitative leap to automotive power electronics potting:

• Efficient Thermal Conductivity 0.7W/m·K: Stable thermal conductivity effectively dissipates heat from power sources, reducing thermal stress on power devices, suitable for high-power scenarios such as IGBT modules, on-board chargers, and solar junction boxes.
• UL94-V0 Flame Retardancy: Halogen-free flame retardant formula, self-extinguishing and non-spreading when exposed to fire, meeting the strict fire safety requirements of automotive electronics and photovoltaic inverters.
• Low Viscosity for Bubble Elimination and Leveling: Mixed viscosity 4500mPa·s, excellent flow, automatic leveling to fill complex cavities, coupled with 2h room-temperature operating time, ensuring no bubbles or voids inside potted parts.
• Strong Adhesion and Mechanical Bonding Seal: After curing: Shore A 60, tensile strength 2.0MPa, elongation 150%, excellent adhesion to aluminum, PCB, plastics, etc., combining mechanical bonding and sealing protection.
• Addition By-Product-Free Deep Curing: 1cm thickness cures at 23℃/8h, heating drastically accelerates (100℃/15min, 150℃/5min), no small molecules released, no internal defects in thick layers.
• Excellent Electrical Insulation: Dielectric strength 23KV/mm, volume resistivity 10¹⁵ Ω·cm, providing reliable insulation protection for high-voltage electronic components.

Application Penetration: From Automotive Electronic Control to Solar Potting The application boundary of IOTA M8760 covers all medium-to-high-power electronic scenarios requiring "thermal conductivity + flame retardancy + flow potting":

• Automotive and Power Electronics Potting (Main Battlefield): Potting protection for automotive electronic components such as on-board chargers (OBC), DC-DC converters, battery management systems (BMS), and motor controllers.
• Solar Potting: Potting seals for photovoltaic junction boxes, inverters, combiner boxes, and other solar equipment, weather-resistant, temperature-resistant, and UV-resistant.
• Mechanical Bonding Seal for Electronic Components: Potting and mechanical fixation for power modules, relays, sensors, etc., combining thermal conductivity and structural bonding.
• Thermally Conductive Products: Raw material for formed thermally conductive products such as thermal pads and thermal putties.

IOTA Technical Guide: 1:1 Mixing, Strictly Prevent Platinum Poisoning

• Application: Mix same-batch A/B components at 1:1 weight ratio; fully stir each component before use (prevent filler settling), vacuum defoaming recommended after mixing before potting; room temperature curing 8h (1cm thickness) or heating acceleration (100℃/15min, 150℃/5min).
• ⚠️ Taboo: Platinum catalyst is extremely sensitive to N, P, S organic compounds and ionic compounds of Sn, Pb, Hg, As, etc.; contact causes catalyst poisoning, incomplete or no curing — strictly avoid contamination; only mix same-batch A/B components, do not mix different batches.
• Storage: Below 23℃, unopened storage 12 months; beyond shelf life, performance testing required before use; A component 25kg/drum, B component 25kg/drum.
• Handling: Mixed room-temperature operating time 2h, complete potting within this window; after curing, color is gray, Shore A 60, curing effect directly observable.

Industry Insight: In the field of automotive-grade thermally conductive potting adhesives, the formulation architecture of addition-molded silicone rubber — "platinum-catalyzed by-product-free + high-fill thermal network + UL94-V0 flame retardant synergy" — is the key path to achieving the four-high goals of "thermal conductivity — flame retardancy — flow — insulation" — addition crosslinking solves the industry pain point of condensation type "releasing by-products, bubble defects", while the synergy of high-fill thermal conductivity and halogen-free flame retardancy ends the application shortcomings of ordinary silicone rubber: "insufficient thermal conductivity, substandard flame retardancy". IOTA M8760, with "two-component addition-molded thermally conductive potting adhesive + 0.7W/m·K + UL94-V0 + 1:1 mixing + 23KV/mm dielectric strength" hard metrics, fills the key supply chain link for domestic automotive-grade thermally conductive potting adhesives in automotive electronics and solar inverters, providing a mass-producible high-performance solution for downstream automotive electronics factories, power manufacturers, and photovoltaic enterprises. This confirms domestic electronic potting adhesives are leaping toward "condensation potting → addition insulation potting → addition thermally conductive flame-retardant potting", with growing technical say in new energy automotive and photovoltaic fields.