During the polishing process, the factors that affect the polishing process are mainly as follows:
① Temperature: When the temperature rises, the chemical reaction ability of the polishing liquid will be enhanced and the polishing rate will be increased. However, too high a temperature will cause the polishing liquid to volatilize and accelerate the chemical reaction, which will cause serious surface corrosion, resulting in uneven polishing effects and reduced polishing quality.
② pH value: The higher the pH value of the polishing liquid, the stronger the alkalinity and the faster the reaction rate. However, the pH value has a great influence on the etching of the polished surface, the decomposition and solubility of the abrasive, the stability of the polishing liquid, etc., which affects the material removal rate and surface quality, so it should be strictly controlled.
③ Pressure: Generally, the greater the pressure, the faster the polishing rate, but when the pressure is too high, the polishing rate will decrease slightly because the excessive pressure will cause the polishing pad to reduce its ability to carry the polishing liquid. In addition, excessive pressure is prone to fragmentation.
④ Speed: Increasing the speed will increase the polishing rate. However, too high a speed will cause the polishing liquid to be unevenly distributed on the polishing pad, thus affecting the polishing quality.
⑤ Polishing fluid concentration: When the concentration of polishing fluid increases, the removal rate also increases. However, when the abrasive concentration exceeds a certain value, the material removal rate will stop increasing and maintain a constant value. This phenomenon is called removal saturation. Moreover, too high a concentration may cause an increase in surface defects (such as scratches), thereby affecting the surface quality.